H30S-1338-2L

H30S-1338-2L is an ultra-thin fanless edge computing platform that achieves fanless and fully enclosed operation. It is equipped with Intel Jasper Lake processor low-power processor, inherits dual network ports, dual serial ports, three display outputs and industrial I/O, and is designed for vibration-prone, dust-prone or silent environments, redefining the reliability boundary of compact industrial terminals.

Core highlights

New upgrade of interface density: Deploy multiple interfaces in a small chassis volume, integrate ​2× 1GbE network ports (equipment chain + management chain isolation), three display outputs (Kiosk split screen/monitoring wall), 6× USB ports (4x USB 3.0+2x USB 2.0+USB-C) and dual COM serial ports (RS232/485) in 1/8 the volume of traditional industrial computers. ​mPCIe direct plug-in 4G module eliminates internal cable failure points.

Industrial reliable design: Metal heat dissipation armor, the whole machine shell is used as a heat sink, supports wide temperature working environment, and effectively improves the life of dust environment. Minimalist power supply, 12V DC input can drive the whole machine + external hard disk/4G module, and adapt to vehicle battery/solar panel/PoE splitter.

Embedded expansion gene: Dual storage slots, M.2 NVMe can be used for system disk + 2.5-inch SATA can be used for data disk. Cellular/wireless ready: mPCIe slot is compatible with LTE modules (such as Quectel EG25-G), and cellular network redundancy is achieved through SIM card slot + antenna hole.